Can produce 1-32 layers
PCB layout - Quick-Turn Prototyping, and Mass Production, covering Single-Sided, Double-Sided, and Multilayer Printed Circuit Boards
It provides small and medium-sized batch production of PCB, and can produce 1-32 layers of boards. With 18 years of production experience,
it serves more than 100 countries and tens of thousands of customers around the world, with quality assurance!
High precision PCB board
Minimum line width and line spacing 3/3mil minimum via 0.15mm
★ It can be used as solder mask bridge and via hole plugging technology
★ There are impedance requirements, electric golden fingers, precise lines, etc.
1~8 layers of rolled copper/electrolytic copper
★ Raw material Shengyi, Taihong and other brands have guaranteed quality
★ It can be used for soft and hard combination, FPC multi-layer board, cable, etc.
Thick copper plate/bare copper plate thermal conductivity 2-3W
★ Thermoelectric separation process, 100% computer open and short circuit test
★ High heat dissipation performance, used for radiators, power supplies, etc.
Aluminum substrate/mixed aluminum substrate thermal conductivity 1-3W
★ Aluminum plate + high thermal conductivity insulating material, high thermal conductivity
★ Up to 8 layers of mixed-pressed aluminum substrates
Provide PCB special process custom production services
Strong engineering team support
Advanced production equipment meets process requirements
Can produce 1-32 layer PCB board
★ Gold-plated board, OSP board, silver board, gold board, tin board, tin plate
★ FR-4, aluminum substrate, cardboard, semi-glass fiber (CEM-1), etc.
Number | Project | Content |
1. | Layers | Single-sided/double-sided/multi-layer (4-32 layers) |
2. | Material | Common: FR-4 (Medium TG High TG), CEM-1 Special: CEM-3, Rogers |
3. | Surface treatment process | Lead-free technology: lead-free HASL, immersion nickel gold, gold plating, organic solder protection film (OSP) |
4. | Special Process | 1. Impedance board (impedance requirement is within ±10%) 2. High copper thick plate (copper thickness of inner and outer layers is 3-4 OZ) 3. High TG board/halogen-free board/halogen-free high TG board |
5. | Processed plate thickness | 0.4-3.2mm |
6. | Processing size | Maximum processing size: 600MM X600MM Minimum processing size: 5MM X 5MM |
7. | Minimum aperture | 0.1mm |
8. | Minimum line width and line spacing | Minimum line width: 0.125mm Minimum line spacing: 0.125mm |
9. | Plate Thickness Aspect Ratio | 1：8 within |
10. | Minimum annular ring | 0.2mm |
11. | Outer copper thickness | 18μm、35μm、70μm、 105μm、140μm |
12. | Solder mask oil film type | Liquid Photosensitive Solder Resist Ink |
13. | Solder resist ink color | Photosensitive series: green, black, red, yellow, white, blue, orange, etc. Matt series: green, black sun ink |
14. | Shape processing method | Die stamping、CNC |
15. | Tolerance | Line width ± 10%, aperture + 3Mil, shape processing ± 0.15MM (special process to be determined separately) |
16. | Coating thickness | 1. HASL: copper thickness 18-25um, tin thickness 5-40um 2. Immersion gold plate: nickel thickness 2.5-5μm, gold thickness 0.05-0.1μm 3. OSP board: film thickness 0.2-0.5um |
17. | Warpage | ≤0.75% |
21 years of experience in plate making
Thousands of customers worldwide
Exquisite workmanship
Timely delivery
